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Global 3D ICs Market

Global 3D ICs Market (MEMS and sensors, RF SiP, Optoelectronics and imaging, Memories, Logic, HB LED) - Industry Analysis, Size, Share, Growth, Trends and Forecast 2013 - 2019

The global 3D ICs market, valued at USD 2,408.2 million in 2012, is expected to see strong growth with 18.1% CAGR during 2013 to 2019. Global semiconductor industry is witnessing shift to 3D IC technology as it provides greater opportunity for developing a broader set of electronic systems and products with exceptional speed, reduction in the chip size, and low power consumption. Rising demand for solutions with improved performance and reduced response time, and growing number of portable devices such as smart-phones and tablets are some of the major factors to drive adoption of 3D ICs. However, high manufacturing and testing cost, lack of foundries and assembly houses to support this technology, thermal and testing issues, are some of the key challenges currently limiting the 3D ICs market growth worldwide.
 
3D IC technology finds its applications in various end-use sectors such as consumer electronics, military, information and communication technology, automotive and aerospace among others. IC manufacturers use different fabrication process for 3D ICs, depending upon requirements of the circuit system such as beam re-crystallization, wafer bonding, silicon epitaxial growth and solid phase crystallization.
 
Penetration of 3D IC technology in various applications is dependent on the need of interconnect density and cost related with particular process. Several industry products such as MEMS and sensors, RF SiP, memories, optoelectronics and imaging, logic (3D SiP/SoC) and HB LED are expected to adopt 3D IC integration. Among these products, ‘MEMS and sensors’ and memories are expected to emerge as leading segments. The increasing popularity of memory enhanced applications is expected to drive demand for the memory (3D stacks) segment in the near future. Geographically, Asia Pacific is expected to become largest market for 3D IC technology, with growth primarily supported by its emerging ICT and consumer electronics sector. Asia Pacific is expected to hold largest market share followed by North America throughout the forecast period. 
 
Eyeing the growth potential with potential breakthrough for mass production, large number of semiconductor and packaging industry players have started to venture into 3D ICs market. Some of the key participants in this market include: Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), Micron Technology Inc. (Elpida Memory Inc.), Intel Corporation, Micron Technology Inc., TEZZARON Semiconductor, STATS ChipPAC Ltd., United Microelectronics Corporation (UMC), Samsung Electronics Co. Ltd., and MonolithIC 3D IC Inc., among others. Among these, players such as Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC), Samsung Electronics Co., Xilinx Inc. Ltd., are considered to have dominant position in the market.

Increasing Demand for Electronic Gadgets to Propel Growth of 3D ICs Market

The increasing demand for solutions with better quality performance is likely to aid in expansion of the global 3D ICs market. The ascent in the interest for cutting edge engineering in the electronic items is considered as the main consideration that is assessed to support the improvement of the worldwide 3D ICs market throughout the following not many years. The developing pattern for the scaling down of the electronic gadgets is assessed to enhance the general improvement of the market in the coming years. Likewise, the fast advancement of the electronics business and the rising appropriation of tablets, cell phones, and gaming gadgets are the other key factors that are projected to guarantee the development of the general market in the coming years.

The significant expense of the 3D ICs is required to go about as a vital test for the worldwide 3D ICs market, which is assessed to hamper the development of the market in the following not many years. Besides, the undeniable degree of coordination prompting warm concerns is foreseen to confine the development of the general market in the following not many years. Moreover, the successful inventory network the board is assessed to act like another significant test for the market players throughout the following not many years. In any case, a critical ascent in the selection of very good quality figuring, server farms, and workers is probably going to offer solid development openings for the market major parts in the coming not many years.

The slow move towards 3D ICs happened with expanded interest for arrangements with higher data transfer capacities and thickness of parts. Expanding interest for memory upgraded application is one of the central point adding to the market development of 3D ICs. Decrease accordingly time, power utilization, structure factor and improved execution fill in as key drivers for acknowledgment of 3D IC with TSV interconnect arrangements. Besides, 3D IC advances are seeing reformist improvements towards the executives of issues related with limited interchanges limit, memory idleness, and chip flagging. Multi-chip bundling and IntSim CAD devices are a portion of the arising mechanical patterns in the 3D ICs market

     
    Chapter 1 Preface
    1.1 Report description and scope
          1.1.1 Market segmentation
    1.2 Research methodology
     
    Chapter 2 Executive Summary
    2.1 Global 3D ICs market snapshot, 2012 & 2019
    2.2 Global 3D ICs market, 2011 – 2019 (USD million)
     
    Chapter 3 3D ICs Market Overview
    3.1 Introduction
    3.2 Market dynamics
          3.2.1 Drivers
                   3.2.1.1 Growing demand for efficient solutions
                   3.2.1.2 Rise in number of portable devices
          3.2.2 Restraints
                   3.2.2.1 High cost, thermal and testing issues
          3.2.3 Opportunities
                   3.2.3.1 Big Data and predictive analytics
    3.3 Trends and future outlook
          3.3.1 Multi-chip packaging
          3.3.2 IntSim
    3.4 Value chain analysis
          3.4.1 Inbound logistics
          3.4.2 Operations
          3.4.3 Out-bound logistics
          3.4.4 Marketing, sales and services
    3.5 Porter’s five forces analysis
          3.5.1 Bargaining power of suppliers
          3.5.2 Bargaining power of buyers
          3.5.3 Threat of substitutes
          3.5.4 Threat of new entrants
          3.5.5 Degree of competition
    3.6 Technology overview
          3.6.1 Shift to 3D IC from 2.5D IC technology
          3.6.2 3D IC fabrication processes
          3.6.3 Standards issues at different levels of 3D IC production
          3.6.4 Patent filings
    3.7 Market attractiveness analysis
    3.8 Competitive analysis
          3.8.1 Market share of key players, 2012 (%)

    Chapter 4 Global 3D ICs Market, by End-Use Industry
    4.1 Global 3D ICs market overview, by end-use industry, 2012 & 2019 (%)
    4.2 Consumer electronics 3D ICs market, 2011 – 2019 (USD million)
    4.3 Information and communication technology 3D ICs market, 2011 – 2019 (USD million)
    4.4 Transport (automotive and aerospace) 3D ICs market, 2011 – 2019 (USD million)
    4.5 Military 3D ICs market, 2011 – 2019 (USD million)
    4.6 Others (Biomedical applications and R&D) 3D ICs market, 2011 – 2019 (USD million)
     
    Chapter 5 Global 3D ICs Market, by Substrate Type
    5.1 Global 3D ICs market overview, by substrate type, 2012 & 2019 (%)
    5.2 Silicon on insulator (SOI) 3D ICs market, 2011 – 2019 (USD million)
    5.3 Bulk silicon 3D ICs market, 2011 – 2019 (USD million)
     
    Chapter 6 Global 3D ICs Market, by Fabrication Process
    6.1 Global 3D ICs market overview, by fabrication process, 2012 & 2019 (%)
    6.2 Beam re-crystallization 3D ICs market, 2011 – 2019 (USD million)
    6.3 Wafer bonding 3D ICs market, 2011 – 2019 (USD million)
    6.4 Silicon epitaxial growth 3D ICs market, 2011 – 2019 (USD million)
    6.5 Solid phase crystallization 3D ICs market, 2011 – 2019 (USD million)
     
    Chapter 7 Global 3D ICs Market, by Product
    7.1 Global 3D ICs market overview, by product, 2012 & 2019 (%)
    7.2 MEMS and sensors 3D ICs market, 2011 – 2019 (USD million)
    7.3 RF SiP 3D ICs market, 2011 – 2019 (USD million)
    7.4 Optoelectronics and imaging 3D ICs market, 2011 – 2019 (USD million)
    7.5 Memories (3D Stacks) 3D ICs market, 2011 – 2019 (USD million)
    7.6 Logic 3D SiP/SoC 3D ICs market, 2011 – 2019 (USD million)
    7.7 HB LED 3D ICs market, 2011 – 2019 (USD million)
     
    Chapter 8 Global 3D ICs Market, by Geography
    8.1 Global 3D ICs market overview, by geography, 2012 & 2019 (%)
    8.2 North America 3D ICs market, 2011 – 2019 (USD million)
    8.3 Europe 3D ICs market, 2011 – 2019 (USD million)
    8.4 Asia Pacific 3D ICs market, 2011 – 2019 (USD million)
    8.5 RoW 3D ICs market, 2011 – 2019 (USD million)
     
    Chapter 9 Company Profiles
    9.1 Taiwan Semiconductor Manufacturing Company, Ltd.
          9.1.1 Company overview
          9.1.2 Financial overview
          9.1.3 Business strategies
          9.1.4 Recent developments
    9.2 XILINX, Inc.
          9.2.1 Company overview
          9.2.2 Financial overview
          9.2.3 Business strategies
          9.2.4 Recent developments
    9.3 The 3M Company
          9.3.1 Company overview
          9.3.2 Financial overview
          9.3.3 Business strategies
          9.3.4 Recent developments
    9.4 STATS ChipPAC Ltd.
          9.4.1 Company overview
          9.4.2 Financial overview
          9.4.3 Business strategies
          9.4.4 Recent developments
    9.5 Tezzaron Semiconductor Corporation
          9.5.1 Company overview
          9.5.2 Financial overview
          9.5.3 Business strategies
          9.5.4 Recent developments
    9.6 United Microelectronics Corporation
          9.6.1 Company overview
          9.6.2 Financial overview
          9.6.3 Business strategies
          9.6.4 Recent developments
    9.7 Ziptronix, Inc.
          9.7.1 Company overview
          9.7.2 Financial overview
          9.7.3 Business strategies
          9.7.4 Recent developments
    9.8 Elpida Memory, Inc. (Micron Technology, Inc.)
          9.8.1 Company overview
          9.8.2 Financial overview
          9.8.3 Business strategies
          9.8.4 Recent developments
    9.9 MonolithIC 3D Inc.
          9.9.1 Company overview
          9.9.2 Financial overview
          9.9.3 Business strategies
          9.9.4 Recent developments
    List of Tables
     
    TABLE 1 3D ICs market segmentation
    TABLE 2 Global 3D ICs market snapshot, 2012 & 2019
    TABLE 3 Impact analysis of drivers
    TABLE 4 Comparison for 2D and 3D designs for low density parity check (LDPC) code decoder
    TABLE 5 Impact analysis of restraint
    TABLE 6 Overview of different 3D IC fabrication processes
    TABLE 7 Issues at different levels of 3D IC
    TABLE 8 Patents by companies
    TABLE 9 Geographical distribution of patents

    List of Figures 

     

    FIG. 1 Global 3D ICs market, 2011 – 2019 (USD million) and Y-o-Y growth (%)

    FIG. 2 Global smartphone and tablet shipment forecast, 2010 – 2015 (million units)

    FIG. 3 Value chain analysis

    FIG. 4 Porter’s five forces analysis

    FIG. 5 Market attractiveness analysis, by end-use sectors, 2012

    FIG. 6 Market share of key players, 2012 (%)

    FIG. 7 Global 3D ICs market overview, by end-use industry, 2012 & 2019 (%)

    FIG. 8 Consumer electronics 3D ICs market, 2011 – 2019 (USD million)

    FIG. 9 Information and communication technology 3D ICs market, 2011 – 2019 (USD million)

    FIG. 10 Transport (automotive and aerospace) 3D ICs market, 2011 – 2019 (USD million)

    FIG. 11 Military 3D ICs market, 2011 – 2019 (USD million)

    FIG. 12 Others (Biomedical applications and R&D) 3D ICs market, 2011 – 2019 (USD million)

    FIG. 13 Global 3D ICs market overview, by substrate type, 2012 & 2019 (%)

    FIG. 14 Silicon on insulator (SOI) 3D ICs market, 2011 – 2019 (USD million)

    FIG. 15 Bulk silicon 3D ICs market, 2011 – 2019 (USD million)

    FIG. 16 Global 3D ICs market overview, by fabrication process, 2012 & 2019 (%)

    FIG. 17 Beam re-crystallization 3D ICs market, 2011 – 2019 (USD million)

    FIG. 18 Wafer bonding 3D ICs market, 2011 – 2019 (USD million)

    FIG. 19 Silicon epitaxial growth 3D ICs market, 2011 – 2019 (USD million)

    FIG. 20 Solid phase crystallization 3D ICs market, 2011 – 2019 (USD million)

    FIG. 21 Global 3D ICs market overview, by product, 2012 & 2019 (%)

    FIG. 22 MEMS and sensors 3D ICs market, 2011 – 2019 (USD million)

    FIG. 23 RF SiP 3D ICs market, 2011 – 2019 (USD million)

    FIG. 24 Optoelectronics and imaging 3D ICs market, 2011 – 2019 (USD million)

    FIG. 25 Memories (3D Stacks) 3D ICs market, 2011 – 2019 (USD million)

    FIG. 26 Logic 3D SiP/SoC 3D ICs market, 2011 – 2019 (USD million)

    FIG. 27 HB LED 3D ICs market, 2011 – 2019 (USD million)

    FIG. 28 Global 3D ICs market overview, by geography, 2012 & 2019 (%)

    FIG. 29 North America 3D ICs market, 2011 – 2019 (USD million)

    FIG. 30 Europe 3D ICs market, 2011 – 2019 (USD million)

    FIG. 31 Asia Pacific 3D ICs market, 2011 – 2019 (USD million)

    FIG. 32 RoW 3D ICs market, 2011 – 2019 (USD million)

    FIG. 33 Taiwan Semiconductor Manufacturing Company, Ltd. annual revenues, 2010 – 2012 (USD billion)

    FIG. 34 Xilinx, Inc., annual revenues, 2010 – 2012 (USD billion)

    FIG. 35 3M Company annual revenues, 2010 – 2012 (USD billion)

    FIG. 36 STATS ChipPAC Ltd., annual revenues, 2010 – 2012 (USD million)

    FIG. 37 United Microelectronics Corporation annual revenues, 2010 – 2012 (USD billion)

    FIG. 38 Micron Technology, Inc., annual revenues, 2010 – 2011 (USD billion)

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Global 3D ICs Market

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